TECHNOLOGY ASSESSMENT
It is always difficult to make a comparable assessment of the
technical advances of several countries and regions. The hardware
technologies for wireless communication are no exception. In fact, due
to the very broad technical topics involved in this chapter, the
challenge is even greater. Therefore, Table 5.1 provided below is based
on the quite subjective judgment of the authors of this chapter. The
WTEC panel as a whole does not disagree with this table.
Table 5.1
Wireless Technology Assessment for Hardware
|
U.S.
|
Japan
|
Europe
|
|
Millimeter Wave Circuits and Systems
|
**
|
*****
|
*****
|
|
Packaging/Interconnect
|
*****
|
****
|
***
|
|
CAD
|
*****
|
**
|
***
|
|
SiGe/Si
|
****
|
***
|
*****1
|
|
III-V
|
*****
|
*****
|
****
|
|
GaN
|
****
|
****
|
***
|
|
Antennas
|
***
|
****
|
***
|
|
Passive Components
|
****
|
*****
|
****
|
|
Amplifier Technique
|
*****
|
****
|
****2
|
|
MEMS/Micromachining
|
****
|
***
|
**
|
1 Germany only; 2 UK
activities
The following six points pertain to the entries in Table 5.1:
- Millimeter Waves. Here, it is very clear that in terms of devices
and MMICs, the United States is ahead of others, largely because of
DARPA's successful MIMIC and MAFET projects. However, the U.S. entry
here reflects expertise in millimeter wave circuits for non-military
wireless applications. In Japan, government-led programs on 60 GHz
wireless technology have been implemented, while in Europe a
substantial effort has been expended mainly for automotive applications
centered around 77 GHz.
- The United States has dominated CAD development and
commercialization and it maintains an unchallenged position.
- In the area of SiGe, IBM is the leader. However, its circuit
applications have lagged behind Daimler's effort, particularly in
millimeter wave areas. In an effort to make the process technology
available to others, IBM and Daimler process technologies are expected
to benefit circuit design efforts funded by other organizations.
- GaN is still in its infancy in industrial applications. Most high
performance devices devices are still at the research stage. It is
interesting to note that the United States is leading in the RF
(microwave) area, i.e., transistor development, while Japan's effort
has mainly been in the area of optical devices. Cree in the United
States and Nichiya in Japan have made excellent materials
available.
- Antenna research has left much to be desired. In wireless
communications, antenna research is meant to be different from the
traditional in terms of the analysis, design, and characterization of
antenna elements and/or phased arrays, from an electromagnetic point of
view. What is needed is the development of an interdisciplinary
research field useful for future wireless technologies. Examples are
the integration of antennas with the RF front end, such as passive
filters, MEMS devices, amplifiers, and even DSPs.
- In the area of passive components, the Japanese are slightly ahead
due to their effort in high Q components led by Murata.
In closing, it should be emphasized that future research on wireless
oriented hardware requires interdisciplinary approaches not only
between hardware and hardware but also between hardware and
software.
Published: July 2000; WTEC
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