APPENDIX D. GLOSSARY
- 3DP
- Three-dimensional Printing (MIT)
- AFPR
- Association Française de Protypage Rapide (France)
- AI
- Artificial intelligence
- AOM
- Acousto-optic modulator
- AP
- Application protocol
- ASA
- Acrylnitril styrene acrylic copolymer
- BIBA
- Bremen Institute for Industrial Technology and Applied Work Science
(EU project)
- BPM
- Ballistic Particle Manufacturing (process and U.S. company)
- BRITE EuRAM
- Basic Research of Industrial Technologies for Europe, European
Research on Advanced Materials program
- CAD
- Computer-assisted design
- CAE
- Computer-assisted engineering
- CALS
- Commerce at Light Speed (Japanese R&D program)
- CAM
- Computer-assisted manufacturing/machining
- CAS
- Computer-assisted surgery
- CAT
- Computed axial tomography
- CBN
-
- Cubic boron nitride
- CLI
- Common layer interface (format alternative to STL)
- CMM
- Coordinate measurement machine
- CNC
- Computer numerical control
- CT
- Computed tomography (medical)
- DFE
- Data Front End, a Cubital software package
- DMEC
- Design Model Engineering Center (Japan)
- DSPC
- Direct Shell Production Casting
- DTM
- A U.S. Corporation based in Austin, TX
- DTM
- Desktop manufacturing
- EARP
- European Action on Rapid Prototyping
- ECM
- Electrochemical machining
- ECU
- European Currency Unit
- EDI
- Electronic data interchange
- EDM
- Electrical discharge machining
- EFTP
- Euro File Transfer Protocol (for arbitrary partners)
- EMI
- Electromagnetic interference
- EOS
- Electro-Optical Systems (Germany)
- EU
- European Union
- FDM
- Fused Deposition Modeling (Stratasys)
- FEA
- Finite element analysis
- FEM
- Finite element mesh
- FhG
- Fraunhofer Institute
- HPGL
- Hewlett-Packard Graphics Language
- I-DEAS
- CAD software from SDRC in Milford, OH
- IFSW
- Institute for Laser Technology (Stuttgart)
- IGES
- Initial graphics exchange specification
- IMS
- Intelligent manufacturing system
- IP
- Intellectual property
- IPR
- Intellectual property rights
- IROFA
- International Robotics and Factory Automation Center
- ISDN
- Integrated services digital network
- ISO
- International Standards Organization
- JARI
- Japan Association of Rapid Prototyping Industries
- JSR
- Japan Synthetic Rubber
- LAN
- Local area network
- LANL
- Los Alamos National Laboratory
- LEAF
- Layer-exchange ASCII format
- LOM
- Laminated Object Manufacturing, trademark of Helisys (LOM-2030(tm))
- LSI
- Large-scale integrated circuits
- MAGICS
- Software, registered trademark of Materialise N.V.
- MJS
- Multiphase jet solidification (IFAM/IPA)
- MRI
- Magnetic resonance interferometry
- NC
- Numeric control (machining/milling)
- NMR
- Nuclear magnetic resonance (MRI or MR now used)
- NURBS
- Nonuniform rational B-spline
- ODETTE [OFTP]
- File transfer protocol for automotive industry and suppliers
- pcb
- Printed circuit board
- PCC
- Precision Castparts Corporation (France)
- PEEK
- One of several super engineering plastics
- PS
- Polystyrene
- QFD
- Quality function deployment
- RIM
- Reaction injection molding
- RP
- Rapid prototyping
- SAHP
- Selective Adhesive and Hot Press Process (Kira)
- SCS
- Solid Creation System (Sony)
- SDM
- Shape deposition modeling/manufacturing
- SFF
- Solid freeform fabrication
- SGC
- Solid ground curing (Cubital)
- SHG
- Second harmonic generation
- SL
- Stereolithography
- SLA
- Stereolithography Apparatus (3D Systems)
- SLP
- Solid laser plotter
- SLS
- Selective laser sintering (DTM Corp.)
- SME
- Society of Manufacturing Engineers
- SOUP
- Solid Object Ultraviolet (laser) Plotter (CMET)
- SPL
- Stereophotolithography
- staircasing
- RP edge effect description
- STEP
- Standard for the exchange of product model data
- STL
- A computer model (CAD) file format that is rendered in triangular facets.
Also called a tessellated file. [Stereolithography Text Language]
- TPM
- An RP cleaning solution
- VR
- Virtual reality
- VRML
- Virtual reality modeling language
- WAN
- Wide area network
- WWW
- Worldwide web
- WZL
- Machine Tool Institute of Aachen, Germany
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Published: March 1997; WTEC Hyper-Librarian