APPENDIX D. GLOSSARY

3DP
Three-dimensional Printing (MIT)
AFPR
Association Française de Protypage Rapide (France)
AI
Artificial intelligence
AOM
Acousto-optic modulator
AP
Application protocol
ASA
Acrylnitril styrene acrylic copolymer
BIBA
Bremen Institute for Industrial Technology and Applied Work Science
(EU project)
BPM
Ballistic Particle Manufacturing (process and U.S. company)
BRITE EuRAM
Basic Research of Industrial Technologies for Europe, European
Research on Advanced Materials program
CAD
Computer-assisted design
CAE
Computer-assisted engineering
CALS
Commerce at Light Speed (Japanese R&D program)
CAM
Computer-assisted manufacturing/machining
CAS
Computer-assisted surgery
CAT
Computed axial tomography
CBN
Cubic boron nitride
CLI
Common layer interface (format alternative to STL)
CMM
Coordinate measurement machine
CNC
Computer numerical control
CT
Computed tomography (medical)
DFE
Data Front End, a Cubital software package
DMEC
Design Model Engineering Center (Japan)
DSPC
Direct Shell Production Casting
DTM
A U.S. Corporation based in Austin, TX
DTM
Desktop manufacturing
EARP
European Action on Rapid Prototyping
ECM
Electrochemical machining
ECU
European Currency Unit
EDI
Electronic data interchange
EDM
Electrical discharge machining
EFTP
Euro File Transfer Protocol (for arbitrary partners)
EMI
Electromagnetic interference
EOS
Electro-Optical Systems (Germany)
EU
European Union
FDM
Fused Deposition Modeling (Stratasys)
FEA
Finite element analysis
FEM
Finite element mesh
FhG
Fraunhofer Institute
HPGL
Hewlett-Packard Graphics Language
I-DEAS
CAD software from SDRC in Milford, OH
IFSW
Institute for Laser Technology (Stuttgart)
IGES
Initial graphics exchange specification
IMS
Intelligent manufacturing system
IP
Intellectual property
IPR
Intellectual property rights
IROFA
International Robotics and Factory Automation Center
ISDN
Integrated services digital network
ISO
International Standards Organization
JARI
Japan Association of Rapid Prototyping Industries
JSR
Japan Synthetic Rubber
LAN
Local area network
LANL
Los Alamos National Laboratory
LEAF
Layer-exchange ASCII format
LOM
Laminated Object Manufacturing, trademark of Helisys (LOM-2030(tm))
LSI
Large-scale integrated circuits
MAGICS
Software, registered trademark of Materialise N.V.
MJS
Multiphase jet solidification (IFAM/IPA)
MRI
Magnetic resonance interferometry
NC
Numeric control (machining/milling)
NMR
Nuclear magnetic resonance (MRI or MR now used)
NURBS
Nonuniform rational B-spline
ODETTE [OFTP]
File transfer protocol for automotive industry and suppliers
pcb
Printed circuit board
PCC
Precision Castparts Corporation (France)
PEEK
One of several super engineering plastics
PS
Polystyrene
QFD
Quality function deployment
RIM
Reaction injection molding
RP
Rapid prototyping
SAHP
Selective Adhesive and Hot Press Process (Kira)
SCS
Solid Creation System (Sony)
SDM
Shape deposition modeling/manufacturing
SFF
Solid freeform fabrication
SGC
Solid ground curing (Cubital)
SHG
Second harmonic generation
SL
Stereolithography
SLA
Stereolithography Apparatus (3D Systems)
SLP
Solid laser plotter
SLS
Selective laser sintering (DTM Corp.)
SME
Society of Manufacturing Engineers
SOUP
Solid Object Ultraviolet (laser) Plotter (CMET)
SPL
Stereophotolithography
staircasing
RP edge effect description
STEP
Standard for the exchange of product model data
STL
A computer model (CAD) file format that is rendered in triangular facets.
Also called a tessellated file. [Stereolithography Text Language]
TPM
An RP cleaning solution
VR
Virtual reality
VRML
Virtual reality modeling language
WAN
Wide area network
WWW
Worldwide web
WZL
Machine Tool Institute of Aachen, Germany
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Published: March 1997; WTEC Hyper-Librarian