GLOSSARY
- 2DEG
- 2-dimensional electron gas
- ADC
- Analog-digital converter
- AFM
- Atomic force microscopy
- AFOSR
- Air Force Office of Scientific Research
- AMLCD
- Active matrix liquid crystal display
- AMO
- Atomic, molecular, and optical
- ARO
- Army Research Office
- ASME
- American Society of Mechanical Engineers
- ATP
- Adenosine triphosphate
- BERAPD
- Biomedical Engineering and Research to Aid Persons with Disabilities (NSF)
- BES
- Basic Energy Sciences office (DOE)
- BES
- Bioengineering and Environmental Systems (NSF/ENG)
- BMDO
- Ballistic Missile Defense Organization
- BOD-FF
- Bond-order-dependent force field
- CAD
- Computer-assisted design
- cermet
- Ceramic/metal composite
- CHE
- Division of Chemistry (NSF/MPS)
- CIP
- Cold isostatic press
- CMOS
- Complementary metal-oxide semiconductor
- CMP
- Chemical mechanical polishing
- CMS
- Civil and Mechanical Systems division (NSF/ENG)
- CRT
- Cathode ray tube
- CSM
- Covalent shell model
- CTS
- Chemical and Transport Systems division (NSF/ENG)
- CVC
- Chemical vapor condensation
- CVD
- Chemical vapor deposition
- CVI
- Chemical vapor infiltration
- DARPA
- Defense Advanced Research Projects Agency
- DMII
- Design, Manufacture, and Industrial Innovation division (NSF/ENG)
- DMR
- Division of Materials Research (NSF/MPS)
- DOC
- Department of Commerce
- DOD
- Department of Defense
- DOE
- Department of Energy
- EC
- Evaporation/condensation generators
- ECS
- Electrical and Communications Systems division (NSF ENG)
- ERATO
- (Japan) Exploratory Research for Advanced Technology program
- ERC
- Engineering Research Center on Microelectronics (University of Illinois)
- ETO
- Education and Training Office (DARPA)
- fcc
- Face centered cubic (metals)
- FET
- Field effect transistor
- FF
- Force field
- FIFO
- First in - first out
- FIM
- Field ion microscope
- FPMD
- First-principles molecular dynamics
- GDS-DFT
- Gaussian dual space density functional theory
- GIC
- Graphite intercolated composites
- GMR
- Giant magnetoresistance
- GPC
- Gas phase condensation
- GPS
- Global Positioning System
- GVB
- Generalized valence bond
- HBFF
- Hessian-based force field
- Hc
- Coercivity
- HDS
- Hydrodesulfurization
- HIP('ing)
- Hot isostatic press(ing)
- HMDS
- Hexamethyl-dilazane
- HPHT
- High pressure/high temperature
- i.d.
- Inner dimension
- IGC
- Inert gas condensation
- IIA
- Individual Investigator Award
- IR
- Infrared
- ISDN
- Integrated Services Digital Network
- LCD
- Liquid crystal display
- LCT
- Liquid crystal templating
- LED
- Light-emitting diode
- LTMC
- Layered transition metal chalcogenide
- MA
- Mechanical alloying
- MBE
- Molecular beam epitaxy
- mCP
- Microcontact printing
- MD
- Molecular dynamics
- MEMS
- Microelectromechanical systems
- MIMIC
- Micromolding in capillaries
- MITI
- (Japan) Ministry of International Trade and Industry
- MOCVD
- Metal oxide chemical vapor deposition
- MOSFET
- Metal oxide semiconductor/field-effect transistor
- MR-CI
- Multireference configuration interaction
- MRSECs
- Materials Research Science and Engineering Centers (NSF)
- MSC
- Materials and Process Simulation Center (California Institute of Technology)
- mTM
- Microtransfer molding
- MURI
- Multidisciplinary (university) research initiative, DOD
- NASA
- National Aeronautic and Space Administration
- NCA
- Nanoparticle chain aggregate
- NCAP
- Nematic curvilinear aligned phase material
- NCCE
- (NSF) National Center for Computational Electronics
- NEIMO
- Newton-Euler Inverse Mass Operator method for modeling
- internal coordinate dynamics
- NEMD
- Nonequilibrium molecular dynamics
- NIH
- National Institutes of Health
- NIST
- National Institute of Standards and Technology
- NMR
- Nuclear magnetic resonance
- NRC
- National Research Council
- NRL
- Naval Research Laboratory
- NSF
- National Science Foundation
- NSOM
- Near-field scanning optical microscopy
- NSS
- Nanoscale systems
- NT
- Nanotechnology
- o.d.
- Outer dimension
- OLED
- Organic light-emitting device
- ONR
- Office of Naval Research
- PAN
- Polyacrylonitrile
- PB
- Polybutadiene
- PBC
- Periodic boundary conditions
- PCD
- Polycrystalline diamond
- PCR
- Polymerase chain reaction
- PDLC
- Polymer-dispersed liquid crystals
- PDMS
- Polydimethylsiloxane
- PI
- Principal Investigator (also, co-PIs)
- POC(s)
- Point(s) of contact
- PS
- Polystyrene
- PS-GVB
- Psuedospectral generalized valence bond
- PVDF
- Poly(vinylidene fluoride)
- QCA
- Quantum cellular automata
- QCL
- Quantum cascade lasers
- Q-dots
- Quantum dots
- QEq
- Charge equilibration
- QM
- Quantum mechanics/mechanical
- RCMM
- Reduced cell multipole method
- redox
- Reduction-oxidation
- RGB
- Red, green, blue
- RTD
- Resonant tunneling diode
- SAM
- Self-assembled monolayer
- SAMIM
- Solvent-assisted microcontact molding
- SAW
- Surface acoustic wave device
- SEP
- Size-dependent evolutionary pattern
- SET
- Single-electron transistor
- SOI
- Silicon on insulator
- SPD
- Superplastic deformation
- SROs
- Scientific Research Initiatives (DOD)
- STA
- (Japan) Science and Technology Agency
- STM
- Scanning tunneling microscope/microscopy
- STN
- Super twisted nematic
- SUNY
- State University of New York
- SWNT
- Single-wall nanotubes
- TBC
- Thermal barrier coating
- TEM
- Transmission electron microscope/microscopy
- TFT
- Thin film transistors
- TMS
- Tech molecular sieves; family of transition metal oxides
- UFF
- Universal force field
- UHV
- Ultrahigh vacuum
- UHVCVD
- Ultrahigh vacuum chemical vapor deposition
- ULSI
- Ultra large scale integrated circuit
- ULTRA
- Ultra Electronics: Ultra Dense, Ultra Fast Computing Components
- Program (DARPA)
- URI
- (University) research initiative (see also MURI, DOD initiative)
- VC
- Vanadium-carbon
- VCSELs
- Vertical cavity surface-emitting lasers
- WC/Co
- Tungsten carbide/cobalt
- WTEC
- World Technology Evaluation Center
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Published: January 1998; WTEC Hyper-Librarian