Appendix F. Glossary
- 2DEG
- 2-dimensional electron gas
- A/D
- Analog to digital
- AAAR
- American Association for Aerosol Research
- ADC
- Analog-digital converter
- AEM
- Analytical electron microscopy
- AFM
- Atomic force microscope/microscopy
- AFOSR
- Air Force Office of Scientific Research
- AIST
- (Japan) Agency of Industrial Science and Technology
- AIST
- (Japan, MITI) Agency of Industrial Science and Technology
- AMLCD
- Active matrix liquid crystal display
- AMM
- Amorphous microporous mixed (oxides)
- AMO
- Atomic, molecular, and optical
- AMR
- Anisotropic magnetoresistance
- ARO
- (U.S.) Army Research Office
- ARPES
- Angle-resolved photoelectron spectroscopy
- ASET
- (Japan) Association of Super-Advanced Electronics Technologies
- ASTC
- Australia Science and Technology Council
- ATP
- (Japan) Angstrom Technology Partnership
- ATP
- Adenosine triphosphate
- B
- Magnetic flux density
- B/H loop
- Closed figure showing B (magnetic flux density) compared to H (magnetic field strength) in a magnetizable material-also called hysteresis loop
- bcc
- Body-centered cubic
- BMBF
- (Germany) Ministry of Education, Science, Research, and Technology (formerly called BMFT)
- BOD-FF
- Bond-order-dependent force field
- BRITE/EURAM
- Basic Research of Industrial Technologies for Europe, European Research on Advanced Materials program
- CAD
- Computer-assisted design
- CAIBE
- Chemically assisted ion beam etching
- CBE
- Chemical beam epitaxy
- CBED
- Convergent beam electron diffraction
- cermet
- Ceramic/metal composite
- CIP
- Cold isostatic press
- CMOS
- Complementary metal-oxide semiconductor
- CMP
- Chemical mechanical polishing
- CMR
- Colossal magnetoresistance
- CNRS
- (France) Centre National de la Récherche Scientifique
- CNSF
- China National Science Foundation
- CRMD
- Centre de Recherche sur la Matire Divise (part of CNRS, France)
- CRT
- Cathode ray tube
- CSM
- Covalent shell model
- CVD
- Chemical vapor deposition
- CVI
- Chemical vapor infiltration
- D/A
- Digital to analog
- DARPA
- (U.S.) Defense Advanced Research Projects Agency
- DM
- Deutsche mark
- DOC
- (U.S.) Department of Commerce
- DOD
- (U.S.) Department of Defense
- DOE
- (U.S.) Department of Energy
- DSC
- Differential scanning calorimetry
- e-beam
- Electron-beam (lithography, etc.)
- EC
- Evaporation/condensation generators
- EC
- European Community (or Commission)
- ECAMI
- European-Canadian Mesoscopic Initiative
- ECNM
- European Consortium on NanoMaterials
- ECU
- European currency unit
- EDX(S)
- Energy-dispersive X-ray (spectroscopy)
- EELS
- Electron energy loss spectroscopy
- EM
- Electromagnetic
- ENEA
- (Italy) National Agency for Energy, Environment and New Technologies
- EPFL
- (Switzerland) École Polytechnique Fédérale de Lausanne
- EPSRC
- (U.K.) Engineering and Physical Sciences Research Council
- ERATO
- (Japan) Exploratory Research for Advanced Technology Program
- ERC
- (U.S., University of Illinois) Engineering Research Center on Microelectronics
- ESCA
- Electron spectroscopy for chemical analysis
- ESPRIT
- European Commission's information technologies program
- ESR
- Electron spin resonance
- esu
- Electrostatic unit
- ETL
- (Japan) Electrotechnical Laboratory
- ETRI
- (Korea) Electronics and Telecommunications Research Institute
- EUSPEN
- European Society for Precision Engineering and Nanotechnology
- EXAFS
- Extended X-ray absorption fine structure spectroscopy
- fcc
- Face centered cubic
- FCRA
- (Japan) Fine Ceramics Research Association
- FE
- Field emission
- FEG-TEM
- Field-emission gun - transmission electron microscope
- FET
- Field effect transistor
- FE-TEM
- Field-emission transmission electron microscope/microscopy
- FETs
- Field-effect transistors
- FF
- Force field
- FFr
- French franc
- FIB
- Focused ion beam
- FIFO
- First in - first out
- FIM
- Field-ion microscope/microscopy
- FM
- Ferromagnetic
- FOA
- (Sweden) National Defense Research Institute
- FPMD
- First-principles molecular dynamics
- FzK
- (Germany) Forschungzentrum Karlsruhe
- GC/MS
- Gas chromotograph mass spectroscopy
- GDS-DFT
- Gaussian dual space density functional theory
- GIC
- Graphite intercalated composites
- GMR
- Giant magnetoresistance
- GP
- Guinier-Preston
- GPC
- Gas phase condensation
- GPS
- Global Positioning System
- GSMBE
- Gas source molecular beam epitaxy
- GVB
- Generalized valence bond
- HBFF
- Hessian-based force field
- Hc
- Coercivity
- HDDR
- Hydrogenation disproportionation desorption recombination
- HDS
- Hydrodesulfurization
- HFET
- Heterojunction field effect transistor
- HIP
- Hot isostatic press
- HMDS
- Hexamethyl-disilazane
- HOPG
- Highly oriented pyrolitic graphic
- HP
- (U.S.) Hewlett-Packard
- HPHT
- High pressure/high temperature
- HPLC
- High performance liquid chromatography
- HREM
- High resolution electron microscope/microscopy
- HRTEM
- High resolution transmission electron microscope (see also HREM)
- HTc
- High superconducting transition temperature
- i.d.
- Inner diameter
- IC
- (France) Institut Curie
- IC
- Integrated circuit
- icd
- internal coordinate dynamics
- IGC
- Inert gas condensation
- IMEC
- (Belgium) Interuniversity MicroElectronics Center
- IP
- Ionization potential
- IPE
- (Switzerland) Institute of Experimental Physics at EPFL
- IR
- Infrared
- ISDN
- Integrated Services Digital Network
- ITO
- Indium tin oxide
- I-V
- Current-voltage
- JFCC
- (Japan) Japan Fine Ceramic Center
- JIM
- Japanese Institute of Metals
- JRCAT
- (Japan) Joint Research Center for Atom Technology
- JSPS
- Japan Society for the Promotion of Science
- K
- Degrees kelvin
- KOH
- Potassium hydroxide
- KTH
- (Sweden) Royal Institute of Technology
- LCD
- Liquid crystal display
- LCT
- Liquid crystal templating
- LCVP
- Laser-induced chemical vapor precipitation
- LED
- Light-emitting diode
- LIGA
- (German acronym) Lithographie, Galvanoformung, Abformung
- LINK
- (U.K.) nanotechnology programme
- LPPCVD
- Laser particle precipitation-aided chemical vapor deposition
- LSI
- Large scale integration/integrated (circuits)
- LTMC
- Layered transition metal chalcogenide
- MA
- Mechanical alloying
- MBE
- Molecular beam epitaxy
- mCP
- Microcontact printing
- MD
- Molecular dynamics
- MEL-ARI
- (Europe, ESPRIT) Microelectronics Advanced Research Initiative
- MEMS
- Microelectromechanical systems
- MFM
- Magnetic force microscopy
- microSQUID
- Micro-superconducting quantum interference device
- MIMIC
- Micromolding in capillaries
- MITI
- (Japan) Ministry of International Trade and Industry
- MOCVD
- Metal organic chemical vapor deposition
- Monbusho
- (Japan) Ministry of Education, Science, Sports, and Culture
- MOS
- Metal oxide semiconductor
- MOSFET
- Metal oxide semiconductor field-effect transistor
- MOVPE
- Metal organic vapor phase epitaxy
- MPI
- (Germany) Max Planck Institute(s)
- MRAM
- Magnetic random access memory
- MR-CI
- Multireference configuration interaction
- MRI
- Magnetic resonance imaging
- MSC
- (U.S., California Institute of Technology) Materials and Process Simulation Center
- MTJ
- Magnetic tunnel junction
- mTM
- Microtransfer molding
- MWNT
- Multiwalled nanotube
- NAIR
- (Japan) National Institute for Advanced Interdisciplinary Research
- NASA
- (U.S.) National Aeronautic and Space Administration
- nc
- Nanocrystalline
- NCA
- Nanoparticle chain aggregate
- NCAP
- Nematic curvilinear aligned phase material
- NCCE
- (U.S., NSF) National Center for Computational Electronics
- NDL
- (Taiwan) National Nano Device Laboratories
- NEDO
- (Japan) New Energy and Industrial Technology Development Organization
- NEIMO
- Newton-Euler inverse mass operator method for modeling
- NEMD
- Nonequilibrium molecular dynamics
- NEOME
- (Switzerland) Network for Excellence on Organic Materials for Electronics
- NFR
- (Sweden) Natural Sciences Research Council
- NIH
- (U.S.) National Institutes of Health
- NION
- (U.K.) National Initiative on Nanotechnology
- NIRIM
- (Japan) National Institute for Research in Inorganic Materials
- NIST
- (U.S.) National Institute of Standards and Technology
- NMR
- Nuclear magnetic resonance
- NNUN
- (U.S.) National Nanofabrication Users Network
- NOR
- not or (used in logic circuits)
- NRC
- (Canada, also Australia) National Research Council
- NRIM
- (Japan) National Research Institute for Metals
- NRL
- (U.S.) Naval Research Laboratory
- NSF
- (U.S.) National Science Foundation
- NSOM
- Near-field scanning optical microscope/microscopy
- NSS
- Nanoscale systems
- NUTEK
- (Sweden) National Board for Industrial and Technological Development
- o.d.
- Outer diameter
- OECD
- (Int'l.) Organization for Economic Cooperation and Development
- OLED
- Organic light-emitting device
- OMBE
- Organic molecular beam epitaxy
- ONR
- (U.S.) Office of Naval Research
- PAN
- Polyacrylonitrile
- PB
- Polybutadiene
- PBC
- Periodic boundary conditions
- PCD
- Polycrystalline diamond
- PCR
- Polymerase chain reaction
- PDLC
- Polymer-dispersed liquid crystals
- PDMS
- Polydimethylsiloxane
- PHANTOMS
- (Europe) program to investigate physics and technology of mesoscale systems
- PL
- Photoluminescence
- PMMA
- Polymethylmethacrylate
- p-n junctions
- Positive-negative
- PoSAP
- position-sensitive atom-probe
- PS
- Polystyrene
- PS-GVB
- Psuedospectral generalized valence bond
- PVD
- Physical vapor deposition
- PVDF
- Poly(vinylidene fluoride)
- QCA
- Quantum cellular automata
- QCL
- Quantum cascade lasers
- QD or Q-dot
- Quantum dot
- QEq
- Charge equilibration
- QM
- Quantum mechanics/mechanical
- QUEST
- (U.S.) Center for Quantized Electronic Structures, UCSB
- rf
- Radio frequency
- RCMM
- Reduced cell multipole method
- redox
- Reduction-oxidation
- RGB
- Red, green, blue
- RHEED
- Reflection high energy electron diffraction
- RIE
- Reactive ion etching
- RIKEN
- (Japan, STA) Institute of Physical and Chemical Research
- RT
- Room temperature
- RTD
- Resonant tunneling diode
- SAM
- Self-assembled monolayer
- SAMIM
- Solvent-assisted microcontact molding
- SAW
- Surface acoustic wave device
- SAXS
- Small angle X-ray scattering
- SBIR
- (U.S.) Small Business for Innovative Research program
- SED
- Single electron device
- SELETE
- (Japan) Semiconductor Leading Edge Technologies, Inc. (consortium)
- SEM
- Scanning electron microscope/microscopy
- Sematech
- (U.S.) Semiconductor Manufacturing and Technology Institute
- SEMPA
- Scanning electron microscopy with polarization analysis
- SEP
- Size-dependent evolutionary pattern
- SET
- Single-electron transistor
- SFM
- Scanning force microscopy/microscope
- SFr
- Swiss franc
- SIMS
- Secondary ion mass spectrometry
- SINQ
- (Switzerland) Spallation Neutron Source
- SIRI
- (Japan) Semiconductor Industry Research Institute
- SMM
- Scanning Maxwell-stress Microscope
- SNOM
- Scanning near-field optical microscopy
- SOI
- Silicon on insulator
- SOQD
- Self-organized quantum dot
- SPC
- Statistical process control
- SPD
- Superplastic deformation
- SPM
- Scanning probe microscopy
- SQUID
- Superconducting quantum interference device
- SRC
- (U.S.) Semiconductor Research Corporation
- SRRC
- (Taiwan) Synchrotron Radiation Research Center
- STA
- (Japan) Science and Technology Agency
- STARC
- (Japan) Semiconductor Technology Academic Research Center
- STEM
- Scanning transmission electron microscope/microscopy
- STM
- Scanning tunneling microscope/microscopy
- STN
- Super twisted nematic
- STTR
- (U.S.) Small Business Technology Transfer program
- SUNY
- (U.S.) State University of New York
- SWNT
- Single-walled nanotubes
- T
- tesla
- TBC
- Thermal barrier coating
- TCR
- Temperature coefficient of resistivity
- TEM
- Transmission electron microscope/microscopy
- TFR
- (Sweden) Research Council for Engineering Sciences
- TFT
- Thin film transistors
- TM
- Melting temperature
- TMS
- Tech molecular sieves; family of transition metal oxides
- TMV
- Trapped magnetization vortice
- TSR
- Tetrahedral shaped recess
- UFF
- Universal force field
- UFP
- Ultrafine particle
- UHV
- Ultrahigh vacuum
- UHV CVD
- Ultrahigh vacuum chemical vapor deposition
- UHV-FE-SEM
- Ultrahigh vacuum field emission scanning electron microscope
- UHV STM
- Ultrahigh vacuum scanning tunneling microscope
- ULSI
- Ultra large scale integration/integrated (circuit)
- VC
- Vanadium-carbon
- VCSELs
- Vertical cavity surface-emitting lasers
- VLSI
- Very large scale integration/integrated (circuit)
- WC/Co
- Tungsten carbide/cobalt
- WTEC
- World Technology Division of the International Technology Research Institute at Loyola College, Baltimore, MD
- XAS
- X-ray absorption spectroscopy
- XPS
- X-ray photoemission spectroscopy
- XRD
- X-ray diffraction
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Published: September 1999; WTEC Hyper-Librarian