JTEC Panel Report on

Electronic Manufacturing and Packaging in Japan

Michael J. Kelly, Chair
William R. Boulton, Editor
John A. Kukowski
Eugene S. Meieran
Michael Pecht
John W. Peeples
Rao R. Tummala

February 1995

TABLE OF CONTENTS

Download: Complete report in PDF format
JTEC/WTEC Staff
Disclaimer
Abstract
Foreword
List of Figures
List of Tables

Executive Summary

Preface

1. Microelectronics in Japan

William R. Boulton

• Introduction
• The U.S. Electronics Industry
• Japan's Electronics Industry
• The Microelectronics Industry Structure
• References

2. Building the Electronic Industry's Roadmaps

William R. Boulton

• Dimensions of Product Development in Japan
• Conclusions
• References

3. Japan's Technology and Manufacturing Infrastructure

William R. Boulton
Eugene S. Meieran
Rao R. Tummala

• Overview of Japan's Technology Infrastructure
• Japan's Technology Development Strategy
• Japan's Product Development Strategy
• Industrial Computerization
• Electronics Research Activities
• Hitachi's R&D Structure
• Conclusion
• References

4. Japan's Electronic Packaging Technologies

Rao R. Tummala
Michael Pecht

• Introduction
• Japan's Electronic Packaging Strategies
• Plastic Packaging Technologies
• Ceramic Packaging Technologies
• Passive Component Technologies
• Advanced Multichip Packaging Developments
• Printed Wiring Board Technologies
• Chip Assembly Technologies
• Package Assembly Technologies
• Future Package Decisions
• Summary Of Japanese Packaging Trends
• Conclusion
• References

5. Electronics Manufacturing and Assembly in Japan

John A. Kukowski
William R. Boulton

• Japan's Distinctive Competence In Manufacturing
• Enabling Technologies
• Factory Automation (FA)
• Japan's Automated Electronics Assembly Demonstrated
• Summary
• References

6. Quality Assurance and Reliability in the Japanese Electronics Industry

Michael Pecht
William R. Boulton

• History of Japan's Quality Movement
• Quality and Reliability Requirements
• Summary
• References

7. Successful Product Realization Strategies

John Peeples
William R. Boulton

• Requirements Definition
• Design for Excellence
• Japanese Technology Commercialization Efforts
• Summary
• References

APPENDICES

A. Professional Experience of Panel Members

B. Professional Experience of Other Team Members

C. Site Reports

• Fujitsu
• Hitachi PERL, HIMEL
• Ibiden
• Matsushita Electric
• Matsushita-Kotobuki Electronics
• Meisei University
• Murata
• Nippondenso
• Nitto Denko
• Oki
• Sony
• TDK

D. Sponsors of the JTEC Study on Electronic Packaging in Japan

E. Attendees of the Industrial Representatives Meeting on April 19, 1993

F. Glossary

Copyright 1995 by Loyola College in Maryland

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