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JTEC Panel Report on

Electronic Manufacturing and Packaging in Japan

Michael J. Kelly, Chair
William R. Boulton, Editor
John A. Kukowski
Eugene S. Meieran
Michael Pecht
John W. Peeples
Rao R. Tummala

February 1995


TABLE OF CONTENTS

Download: Complete report in PDF format
JTEC/WTEC Staff

Disclaimer
Abstract
Foreword
List of Figures
List of Tables

Executive Summary

Preface

1. Microelectronics in Japan

William R. Boulton

2. Building the Electronic Industry's Roadmaps

William R. Boulton

3. Japan's Technology and Manufacturing Infrastructure

William R. Boulton
Eugene S. Meieran
Rao R. Tummala

4. Japan's Electronic Packaging Technologies

Rao R. Tummala
Michael Pecht

5. Electronics Manufacturing and Assembly in Japan

John A. Kukowski
William R. Boulton

6. Quality Assurance and Reliability in the Japanese Electronics Industry

Michael Pecht
William R. Boulton

7. Successful Product Realization Strategies

John Peeples
William R. Boulton

APPENDICES

A. Professional Experience of Panel Members

B. Professional Experience of Other Team Members

C. Site Reports

D. Sponsors of the JTEC Study on Electronic Packaging in Japan

E. Attendees of the Industrial Representatives Meeting on April 19, 1993

F. Glossary

Copyright 1995 by Loyola College in Maryland


Published: February 1995; WTEC Hyper-Librarian
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