APPENDIX F. GLOSSARY

ACA

Anisotropic Adhesive Connection

AD

Active Device

AGV

Automated Guided Vehicle

AI

Artificial Intelligence

AMLCD

Active Matrix Liquid Crystal Display

ASIC

Application-Specific Integrated Circuit

ASIM

Application-Specific Integrated Module

AV

Audiovisual

AXPC

A UNIX operating system unique to Japan

B-PGA

Bumped Pin Grid Array

BGA

Ball Grid Array

CD

Compact Disk

CD-ROM

Compact Disk Read Only Memory

C-PGA

Ceramic Pin Grid Array

CCL

Copper Clad Laminate

CFC

Chlorofluorocarbon

CAD

Computer-Assisted Design

CAE

Computer-Assisted Engineering

CAM

Computer-Assisted Manufacturing

CIM

Computer-Integrated Manufacturing

CISC

Complex Instruction Set Chip

COB

Chip On Board

COF

Chip on Flex Board

CTE

Coefficient of Thermal Expansion

CRT

Cathode-Ray Tube

DCC

Digital Compact Cassette

DFX

Design For Excellence

DIP

Dual Inline Package

DRAM

Dynamic Random Access Memory

ECU

Electronic Control Unit

EMI

Electromagnetic Interference

FA

Factory Automation

FMS

Flexible Manufacturing System

FOB

Film On Board

FOG

Film On Glass

FPQFP

Fine Pitch Quad Flat Package

GaAs

Gallium Arsenide

HDA

Hard Disk Assembly

HDD

Hard Disk Drive

HDTV

High Definition Television

HF

High Frequency

HIC

Hybrid Integrated Circuit

IC

Integrated Circuit

I/O

Input/Output

IR

Infrared

ISDN

Integrated Service Digital Network

ISO (9000, etc.)

International Standards Organization standards

KGA

Known Good Assembly

KGD

Known Good Die

LCD

Liquid Crystal Display

LGA

Land Grid Array

LSI

Large-Scale Integration

LTCC

Low-Temperature Ceramic Carrier/Component

MC

Molding Compound

MCM

Multichip Module

MCM-C

Multichip Module-Ceramic

MCM-D

Multichip Module-thin film Dielectric

MCM-L

Multichip Module-Laminate

MD

Mini Disk

MLC

Multilayer Ceramic

MOCVD

Metal Oxide Chemical Vapor Deposition

OA

Office Automation

PA

Personal Assistant

PC

Personal Computer; also, Printed Circuit

PCA

Printed Circuit Assembly

PCB

Printed Circuit Board

PCMCIA

Personal Computer Memory Card Industry Association (card standard)

PDA

Personal Digital Assistant

PDIP

Plastic Dual Inline Package

PEM

Plastic Epoxy Molded

PGA

Pin Grid Array

PLCC

Plastic Leaded Chip Carrier

PPB

Parts Per Billion

PPM

Parts Per Million

PQFP

Plastic Quad Flat Package

PTH

Pin Through hole

PWB

Printed Wiring Board

QA

Quality Assurance

QC

Quality Control

QCD

Quality, Cost, Delivery

QFJ

Quad Flat J-type (package)

QFP

Quad Flat Package

QML

Qualified Manufacturing List

QPL

Qualified Parts List

QSSOP

Quartersize Small Outline Package

RF

Radio Frequency

SBB

Stud Bump Bond

SEM

Scanning Electron Microscope

SD

Structural Device

SDIP

Shrink Dual Inline Processing

SIA

Semiconductor Industry Association

SIP

Small Inline Package

SLC

(IBM's) Surface Laminar Circuit

SM

Surface Mount

SMD

Surfact Mount Device

SMT

Surface Mount Technology

SOJ

Small Outline J-leaded (package)

SOP

Small Outline Package

SPC

Statistical Process Control

SQFP

Shrink Quad Flat Package

SQC

Statistical Quality Control

SSOP

Shrink Small-Outline Package

STD

Strategic Technology Domain

STN

Super Twisted Nematic (type of LCD)

TAB

Tape Automated Bonding

TCE

Thermal Coefficient of Expansion

TCP

Tape Carrier Package

TFMCM

Thin Film Multichip modules

TFT

Thin Film Transfer

TMA

Thermal Mechanical Analysis

TPM

Total Preventive Maintenance

TQC

Total Quality Control

TQFP

Thin Quad Flat Package

TQM

Total Quality Management

TSOP

Thin Small Outline Package

TSSOP

Thin Sealed Small Outline Package

TTQFP

Thin, Thin Quad Flat Package

ULSI

Ultra Large Scale Integration

Vcc

Cathode-Cathode Voltage

Vdd

Drain Voltage

VCR

Video Cassette Recorder

VHS

Standard for VCRs initiated by Matsushita

VLSI

Very Large Scale Integration

VSOP

Very Small Outline Package

VSQFP

Very Small Quad Flat Package

VTR

Video Tape Recorder

ZD

Zero Defects