Phillip R. Barela

Mr. Barela works at the Jet Propulsion Laboratory in Pasadena, CA. He began his career at JPL as a failure analyst. Currently he is Technical Group Supervisor for the Applications Engineering Group within Quality Assurance. Mr. Barela is chartered with participating in design, manufacture, and test of space flight hardware. He actively participates in numerous research and development activities that deal with advanced packaging applications for space flight hardware. He evaluates packaging designs and develops process controls for low-volume manufacturing with a focus on placing quality assurance in a proactive posture during design and manufacturing.

Mr. Barela worked as an RF electronic systems technician while still an undergraduate. Since receiving his B.S. degree in manufacturing engineering, he has filled numerous packaging design, failure analyst, and manufacturing positions at Gould Electronics, NavCom Defense Systems, Loral Electro-Optical Systems and the Jet Propulsion Laboratory. Mr. Barela has served as lead manufacturing engineer in hybrid (thick and thin) MCMs, COB, through-hole, surface mount, and mixed assembly facilities. In this capacity, Mr. Barela started numerous product lines for low- to medium-volume military and space products. He has extensive experience with producibility issues relating to new and mature product lines (e.g., DOE, QFD, DFM, DFI, DFR, SPC, etc.).

Mr. Barela is a certified manufacturing technologist through the Society of Manufacturing Engineers (SME). He is a member of SME, ISHM, SMTA, SOCE, EOS/ESD Assoc. and the IPC. Mr. Barela is currently attending UCLA, working towards his master's degree in manufacturing engineering.

George Harman

George Harman is a Fellow at the National Institute of Standards and Technology (formerly NBS), Chair of the IEEE CHMT's Fellows Committee since 1988, and President of ISHM (1994-1995). He was a Trustee of the Federation of Materials Societies (1988-1990) as well as the Chair of the IEEE CHMT society's nominating committee (1982-1988). Mr. Harman is a Fellow of the IEEE and ISHM, Member of IEPS, American Physical Society, ASTM, Sigma Xi, and Sigma Pi Sigma.

Since 1984, Mr. Harman has traveled to East Asia (Singapore, Malaysia, Taiwan, Hong Kong, Philippines, Korea, and Japan) lecturing and consulting at 17 American-owned facilities.

Mr. Harman has received numerous awards. The Department of Commerce awarded him the Silver Medal (1973) and the Gold Medal (1979). NIST awarded him the E.U. Condon Award for best publication in 1990. He received the Centennial Medal (1984), CHMT Outstanding Contributions Award (1992), and the ECTC Sustained Distinguished Service Award (1993) from IEEE. ISHM has also conferred several awards on Mr. Harman, including its Technical Achievement Award (1981), Lewis F. Miller Award (1984), Daniel C. Hughes Award the society's top award, (1988), and the ISHM Foundation Distinguished Service Award (1990).

Mr. Harman received a B.S. in physics from VPI & SU, and an M.S. in physics from the University of Maryland. He was a Research Fellow at the University of Reading (England). He has published 40 papers, one book (a second is under contract), and has been granted 4 patents.

M. Gene Lim

M. Gene Lim is President of SEAM International Associates and a member of the Industry Advisory Board for the Rochester Institute of Technology. He is a consultant for the Institute for Defense Analyses (IDA) and Systems Planning Corporation (SPC) for the U.S. Department of Defense. Dr. Lim previously was President of Westinghouse Nuclear, Korea, in Seoul, Korea. Prior to that he was Manager of Japan Operations for Westinghouse in Kobe, Japan.

Gene Lim has 17 years of overseas-based experience in government affairs, technology transfer and license administration, marketing, and project implementation for international projects in Japan and Korea. Dr. Lim received his Ph.D. in nuclear science and engineering from the University of Virginia.

Nicholas J. Naclerio

Nicholas J. Naclerio is a program manager in the Electronic Systems Technology Office of the Advanced Research Projects Agency (ARPA). In that capacity, he manages several major electronics manufacturing initiatives including SEMATECH and ASEM. ASEM is a new ARPA program aimed at developing a merchant supplier infrastructure for application-specific electronic modules. He also serves as executive director of two federal advisory committees: the National Advisory Committee on Semiconductors (NACS) and the Advisory Council on Federal Participation in SEMATECH. Prior to joining ARPA he held positions at the Air Force's Wright Laboratories as Chief of the Manufacturing Technology Directorate's Information Management Branch and earlier as a research program manager in the Design Branch of the Electronic Technology Laboratory.

Dr. Naclerio holds a bachelor's degree in electrical engineering and computer science from Duke University, a master's degree in material science from the University of Cambridge (England), and a Ph.D. in electrical engineering from the University of Maryland. He has published numerous articles in areas such as microcircuit fabrication, computer-aided design algorithms, and engineering information systems.

Linton G. Salmon

Dr. Salmon recently completed a tour as the director of the solid state and microstructures program for the National Science Foundation. In that capacity, he directed NSF funding of research in electronic materials, semiconductor manufacturing, advanced processes, electronic packaging, and microelectromechanical systems (MEMS). Dr. Salmon came to NSF from Brigham Young University, where he has now returned to his position as Associate Professor. His current research interests include MEMS applications and packaging, multichip module packaging, and high-speed VLSI integrated circuits. Previously, he was Director of GaAs Engineering at Rockwell International, where he directed the development of advanced designs and processes for III-V integrated circuits and multichip packaging. Earlier he was head of GaAs Technology and Molecular Beam Epitaxy Sections at Hughes Research Laboratories. He received his B.S. degree in Physics from Stanford University, M.S. and Ph.D. degrees in Applied Physics from Cornell University.

R. Duane Shelton

Robert Duane Shelton has led international technology assessments since 1984, as science policy analyst at NSF, and now as ITRI Director. He is currently on sabbatical from Loyola College in Maryland , serving as IEEE Congressional Fellow in the office of Rep. Lloyd Doggett (D. TX).

Dr. Shelton's degrees are in electrical engineering from Texas Tech (MCL), MIT (as NSF Fellow), and the University of Houston. Dr. Shelton worked at Texas Instruments on electronics R&D and at NASA in performance analysis of the Apollo space communications system and of TDRSS - the system currently used for Shuttle communications.

He has been a professor at the University of Houston, University of Louisville, Texas Tech University, and now Loyola College. During this time, he has served as principal investigator on 35 grants, has written 58 technical papers and one book, and has chaired 57 M.S. and 3 Ph.D. thesis committees. He has chaired academic departments of applied mathematics, computer science, and electrical engineering. His current research interest is science policy analysis: international technology assessment, high-technology trade problems with Japan, and national strategies for engineering education.

Published: February 1995; WTEC Hyper-Librarian