APPENDIX A. PROFESSIONAL EXPERIENCE OF PANEL MEMBERS

Michael J. Kelly (Panel Chair)

Dr. Michael Kelly is Director of the Manufacturing Research Center at Georgia Institute of Technology. Prior to accepting that position in October 1991, he was Director of the Defense Manufacturing Office at Defense Advanced Research Projects Agency (DARPA), during which time he was also Executive Director of the National Advisory Committee on Semiconductors. He came to DARPA in January 1989 from the New Jersey Institute of Technology, where he was Director of Computer Integrated Manufacturing and Technology Transfer.

Dr. Kelly's career includes seventeen years with IBM. His IBM experience included ten years in East Fishkill, where he had management responsibilities for designing and developing computer-aided design tools, electron beams and related lithography tools, and manufacturing system architecture. From 1979 to 1984, he was manager of IBM's Manufacturing Technology Center in Boca Raton, Florida, with responsibilities for establishing the architecture and specifications for computer-integrated manufacturing systems and continuing support through implementation at IBM facilities. During that same period, he initiated the multimillion dollar IBM support of manufacturing-oriented curricula development at universities and two-year colleges. In 1984, he accepted a special assignment to assist in preparation for the move of the Corporate Technical Institutes to a new facility in Thornwood, New York. During that same year, he became director of the Quality Institute, where he organized the program to educate and train all IBM employees on the principles of total quality management. Following his one-year assignment as Director of the Quality Institute, he transferred to the IBM Systems Technology Division as Manager of Quality Improvement and Professional Development programs, where he worked for the establishment of quality programs in two IBM plants in the United States (Endicott, N.Y. and Austin, TX) and two IBM plants in Canada (Bromont and Toronto).

Prior to joining IBM, Michael Kelly was an associate professor of electrical and mechanical engineering and Director of the Engineering Case Program at Stanford University. His other academic experience includes three years of teaching at the University of Detroit, where he also served as director of the university's computer center, and four years of teaching and administration at Marist College. Dr. Kelly holds a B.A. degree from Marist College, B.E.E. and M.E.E. degrees from Catholic University, and a Doctor of Engineering degree from the University of Detroit.

William R. Boulton (Editor)

Dr. William Boulton is the Olan Mills Professor of Strategic Management and was the Director of the Center for International Commerce at Auburn University. He completed his doctorate at Harvard Business School in 1977 and taught at the University of Georgia for thirteen years prior to moving to Auburn in 1990.

Dr. Boulton has published extensively on topics related to Japan, competitive strategy, and technology management. In an attempt to encourage business schools to teach technology management, he recently completed A Resource Guide on the Management of Innovation and Technology for the AACBS, the accrediting organization for business schools.

He has lived over six years in Japan since his first visit in 1961. He has worked and conducted research in such firms as Hitachi, Sharp, Matsushita Electric, NEC Corporation, GTE International, and Singer Corporation. In 1986, he was a Fulbright Scholar in Japan researching the robotics and factory automation industries. In 1991, he was a visiting scholar at the prestigious Institute for Fiscal and Financial Policy, part of Japan's Ministry of Finance. In 1992 he was a visiting professor at Keio University's business school, where he returned in August 1993. He continues to research technology management issues in the United States and Japan.

John A. Kukowski

John Kukowski currently holds the position of Corporate Fellow at Universal Instruments Corporation. Presently he is completing a fellowship at Rochester Institute of Technology, where he is working as a research associate in electronics manufacturing and is enrolled in the master's program for computer-integrated manufacturing. Mr. Kukowski is a co-leader of the Electronics Industrial Advisory Board and is an active participant in the establishment of an interdisciplinary electronics design and manufacturing curriculum at RIT.

Mr. Kukowski has been employed with Universal Instruments for 23 years and has served in various capacities, including tool and die maker, manufacturing engineer, design engineer, Manager of Design Engineering, Manager of Manufacturing Engineering, Operations Manager, Vice President of Engineering, and recently, Vice President of Advanced Technology. Mr. Kukowski was the project leader for the first vision-guided placement machine developed by Universal Instruments and led the implementation of flexible manufacturing for the assembly of automated placement machinery.

He holds two patents in automated assembly machine design and has conducted research in the fields of surface mount assembly of printed circuit boards, tape automated bonding, and flip chip attach. He is a member of the Industrial Advisory Board at Broome Community College and is the recipient of the Universal Instruments Dale Chubb award for outstanding technical contribution.

Eugene S. Meieran

Eugene S. Meieran received his B.S. degree from Purdue University in 1959 and his M.S. and Sc.D. degrees from the Massachusetts Institute of Technology in 1961 and 1963, respectively, in the field of material science.

He then joined Fairchild Semiconductor Research and Development Laboratories in Palo Alto, CA, as a member of the technical staff, where he assumed responsibility for the materials analysis laboratories. In 1973 he joined Intel Corporation in Santa Clara, CA, as Manager of Package Development, with responsibility for developing new lines of plastic and hermetic packages for emerging memory and microprocessor products. In 1977 he transferred to the Quality and Reliability staff, with responsibility for all Intel materials, for the newly established Analysis and Characterization Laboratory, and for key elements of the wafer fab and assembly reliability functions. For seven years Dr. Meieran was responsible for all the quality and reliability functions for the East Asian and Caribbean assembly plants. In 1985 he was appointed Intel Fellow, the second in the company's history. He has been working in the fields of statistical process control (SPC) and artificial intelligence in Intel's Manufacturing Systems Technology Group, with responsibility for introducing advanced computer and system technologies into Intel's component manufacturing facilities. Dr. Meieran is a member of the Intel Museum Committee, the Intel Research Council, and the Intel Academic Relations Council. He has received two Intel Achievement Awards for his contributions to Intel.

Dr. Meieran has taught at Stanford University and the University of California at Berkeley and has given seminars and invited talks to many universities throughout the world. He has published extensively in the fields of SPC, materials analysis, process and product reliability, and more recently, AI applications, with about 50 technical papers published in international journals. He has been awarded three international awards based on technical presentations on his work in semiconductor device reliability, with emphasis on the phenomena of electromigration in thin films, soft error upsets in DRAM devices, and material analysis technology. Dr. Meieran founded in 1973 and has actively participated in the Electronic Materials Symposium.

In 1987, Dr. Meieran was made Distinguished Engineering Alumnus by Purdue University. He has been on the Scientific and Education Advisory Board for Lawrence Berkeley Labs and is currently on the Advisory Board for the Department of Electrical Engineering/Computer Science at U.C. Berkeley. He was appointed Codirector for the MIT Leaders For Manufacturing Program in 1993.

Michael Pecht

Dr. Michael Pecht is a professor at the University of Maryland with a joint appointment in systems research and mechanical engineering. He is also Director of the Computer-Aided Life Cycle Engineering (CALCE) Electronic Packaging Research Center at U.M., which is supported by the National Science Foundation. Dr. Pecht has a B.S. in acoustics, an M.S. in electrical engineering, and a Ph.D. in engineering mechanics from the University of Wisconsin. He is a professional engineer and an IEEE Fellow. He serves on the board of advisors for various companies and was a Westinghouse professor.

He is the chief editor of IEEE Transactions on Reliability, a section editor for the Society of Automotive Engineering, and is on the advisory board of IEEE Spectrum. He has edited five books on electronics design, reliability assessment, and qualifications.

John Peeples

Dr. John Peeples is an assistant vice president of manufacturing for AT&T Global Information Solutions (formerly NCR) and Director of the Manufacturing Technology Research Center (MTRC) located in West Columbia, SC. The center identifies, develops or coordinates the development of and deploys technology to company manufacturing sites worldwide, with particular emphasis in the area of electronic module assembly and test technology. The center is a key concurrent engineering element within the company and owns the corporate design rules for electronic module assembly and test.

Additionally Dr. Peeples is the leader of the Director of Engineering Peer Team for the General Purpose Product Group. This team's mission is to enhance development productivity through continuous improvement of the development infrastructure.

Dr. Peeples was with NCR for 17 years prior to becoming part of AT&T management, and he has served in various capacities within the departments of component engineering, design engineering, management of reliability engineering, product evaluation engineering, and advanced systems development. He served as director of operations and, prior to his current job, as director of engineering for the West Columbia NCR facility.

Dr. Peeples received his B.S. in electrical engineering from the Citadel in 1970 and his M.S. and Ph.D. degrees from the University of South Carolina in 1976 and 1978, respectively.

Dr. Peeples is a member of the IEEE and has served in various capacities, including those of general chairman and chairman of the board of directors for the IEEE International Reliability Physics Symposium. He is currently the only nonteaching professional on the Science Framework Writing Team for the state of South Carolina. Dr. Peeples serves on industrial advisory boards for the University of South Carolina and Georgia Tech.

Rao R. Tummala

Rao R. Tummala is a chaired professor in the Electrical Engineering Department at Georgia Tech. Previously, he was an IBM Fellow at IBM East Fishkill Packaging Laboratory in New York. After joining IBM in 1968, he invented a number of thick film materials and processes for IBM's products for magnetic storage, displays, printers, and packaging. In the process, Dr. Tummala was awarded 21 U.S. patents, made 45 other inventions, published 60 papers in professional society journals, and presented over 70 keynote, invited, and other talks throughout the world. He coedited a book entitled Microelectronics Packaging Handbook, which was recently translated into Japanese.

Dr. Tummala received a B.S. in mathematics, physics, and chemistry, and a B.E. in metallurgical engineering from universities in India, an M.S. in metallurgical engineering from a Canadian university, and a Ph.D. in ceramics from the University of Illinois. Dr. Tummala is a member of the National Academy of Engineering, a Fellow of the American Ceramic Society, the Technical Vice President of the International Society for Hybrid Microelectronics (ISHM), and a member of the Board of Governors of the IEEE-CHMT.

Dr. Tummala received nine IBM Invention Awards, three IBM Divisional Awards, one IBM Corporate Award, and three IBM Publication Awards. He also received the John Wagnon Technical Achievement Award from ISHM, a Best Paper Award from IEEE, the Engineering Materials Award from the American Society for Metals, the Distinguished Alumni Award for outstanding service in engineering from the University of Illinois, and the David Sarnoff Award from IEEE.



Published: February 1995; WTEC Hyper-Librarian