APPENDIX F. GLOSSARY

ACF
Anisotropic conductive film
ASIC
Application specific integrated circuit
ASM
ASM International (materials-related professional society formerly known as the American Society for Metals)
BGA
Ball grid array
CAM
Computer-assisted manufacturing
CCDs
Charge-coupled devices
CD
Compact disk
CD-ROM
Compact disk-read-only memory
CEM-based materials
A grade of motherboard material
CIM
Computer-integrated manufacturing
CM
Contract manufacturer
CMM
Ceramic multicomponent modules
CMOS
Complementary metal oxide semiconductor
CNC
Computer numerical control
COB
Chip on board
COG
Chip on glass
CPU
Central processing unit
CRT
Cathode ray tube
CSP
Chip-scale packaging
DIP
Dual in-line package
DRAM
Dynamic random access memory
DSP
Digital signal processing
DSS
Direct satellite systems
EMC
Electromagnetic compatibility
ERSO
Electronics Research and Services Organization (Taiwan)
Fab
Semiconductor (wafer) fabrication facility
FED
Field emission display
FR
Flame-retardant
FTZ
Free trade zone
GDP
Gross domestic product
GNP
Gross national product
HDD
High-definition displays
HDTV
High-definition television
HKPC
Hong Kong Productivity Council
I/O
Input/output
IC
Integrated circuit
IDE
Integrated drive electronics (hard drive interface for personal computers; standard developed by Western Digital in 1986)
ISDN
Integrated services digital network
IT
Information technology
ITDC
Industry and Technology Development Council (HK)
ITRI
Industrial Technology Research Institute (Taiwan)
KME
Kyushu Matsushita Electric (branch of Matsushita)
LCD
Liquid crystal display
LED
Light-emitting diode
LSI
Large-scale integration
MCM
Multichip module
MCM-D
Multichip module-thin film dielectric
MCM-L
Multichip module-laminate
MD
Mini disk
MEI
Ministry of Electronics Industry (PRC)
MNC
Multinational corporation
MOEA
Ministry of Economic Affairs (Taiwan)
MPEG
Moving Pictures Experts Group (standard for coding audio-visual information in a digital compressed format)
NIE
Newly industrializing/ed economy/ies
ODM
Original Design Manufacturer
OEM
Original Equipment Manufacturer
OLB
Outer lead bonding
OSE
Oriental Semiconductor Electronics
PC
Personal computer
PCB
Printed circuit board
PCBA
Printed circuit board assembly
PCMCIA
Personal Computer Memory Card International Association (interface standard for portable personal computer peripherals, now called "PC Card")
PDA
Personal digital assistant
PDIP
Plastic dual in-line package
PDP
Plasma display panel
PHS
Personal handyphone system
PLCC
Plastic leaded chip carrier
PPGA
Plastic pin grid array
PQFP
Plastic quad flat package
PRC
People's Republic of China
PWB
Printed wiring boards
QFP
Quad flat package
RF
Radio frequency
ROI
Return on Investment
SBB
Stud bumping bonding
SEM
Scanning electron microscope
SEZ
Special Economic Zone
SMD
Surface mount devices
SMT
Surface mount technology
SOJ
Small outline "J" type package
SRAMs
Static random-access memory
SSTC
State Science and Technology Commission (PRC)
STN
Super-twisted nematic
TAB
Tape-automated bonding
TCP
Tape carrier package
TFT
Thin-film transfer
TFT LCD
Thin-film transistor liquid crystal display
TSOP
Thin small outline packages
VCO
Voltage-controlled crystal oscillators
VCR
Video cassette recorder
VG
Video graphics
VGA
Video graphics adapter

Published: May 1997; WTEC Hyper-Librarian