APPENDIX F. GLOSSARY

ACF

Anisotropic conductive film

ASIC

Application specific integrated circuit

ASM

ASM International (materials-related professional society formerly known as the American Society for Metals)

BGA

Ball grid array

CAM

Computer-assisted manufacturing

CCDs

Charge-coupled devices

CD

Compact disk

CD-ROM

Compact disk-read-only memory

CEM-based materials

A grade of motherboard material

CIM

Computer-integrated manufacturing

CM

Contract manufacturer

CMM

Ceramic multicomponent modules

CMOS

Complementary metal oxide semiconductor

CNC

Computer numerical control

COB

Chip on board

COG

Chip on glass

CPU

Central processing unit

CRT

Cathode ray tube

CSP

Chip-scale packaging

DIP

Dual in-line package

DRAM

Dynamic random access memory

DSP

Digital signal processing

DSS

Direct satellite systems

EMC

Electromagnetic compatibility

ERSO

Electronics Research and Services Organization (Taiwan)

Fab

Semiconductor (wafer) fabrication facility

FED

Field emission display

FR

Flame-retardant

FTZ

Free trade zone

GDP

Gross domestic product

GNP

Gross national product

HDD

High-definition displays

HDTV

High-definition television

HKPC

Hong Kong Productivity Council

I/O

Input/output

IC

Integrated circuit

IDE

Integrated drive electronics (hard drive interface for personal computers; standard developed by Western Digital in 1986)

ISDN

Integrated services digital network

IT

Information technology

ITDC

Industry and Technology Development Council (HK)

ITRI

Industrial Technology Research Institute (Taiwan)

KME

Kyushu Matsushita Electric (branch of Matsushita)

LCD

Liquid crystal display

LED

Light-emitting diode

LSI

Large-scale integration

MCM

Multichip module

MCM-D

Multichip module-thin film dielectric

MCM-L

Multichip module-laminate

MD

Mini disk

MEI

Ministry of Electronics Industry (PRC)

MNC

Multinational corporation

MOEA

Ministry of Economic Affairs (Taiwan)

MPEG

Moving Pictures Experts Group (standard for coding audio-visual information in a digital compressed format)

NIE

Newly industrializing/ed economy/ies

ODM

Original Design Manufacturer

OEM

Original Equipment Manufacturer

OLB

Outer lead bonding

OSE

Oriental Semiconductor Electronics

PC

Personal computer

PCB

Printed circuit board

PCBA

Printed circuit board assembly

PCMCIA

Personal Computer Memory Card International Association (interface standard for portable personal computer peripherals, now called "PC Card")

PDA

Personal digital assistant

PDIP

Plastic dual in-line package

PDP

Plasma display panel

PHS

Personal handyphone system

PLCC

Plastic leaded chip carrier

PPGA

Plastic pin grid array

PQFP

Plastic quad flat package

PRC

People's Republic of China

PWB

Printed wiring boards

QFP

Quad flat package

RF

Radio frequency

ROI

Return on Investment

SBB

Stud bumping bonding

SEM

Scanning electron microscope

SEZ

Special Economic Zone

SMD

Surface mount devices

SMT

Surface mount technology

SOJ

Small outline "J" type package

SRAMs

Static random-access memory

SSTC

State Science and Technology Commission (PRC)

STN

Super-twisted nematic

TAB

Tape-automated bonding

TCP

Tape carrier package

TFT

Thin-film transfer

TFT LCD

Thin-film transistor liquid crystal display

TSOP

Thin small outline packages

VCO

Voltage-controlled crystal oscillators

VCR

Video cassette recorder

VG

Video graphics

VGA

Video graphics adapter