- Orient Semiconductor Electronics, Ltd. (OSE)
12-2 Nei Huan South Rd, N.E.P.Z. Kaohsiung, Taiwan, 81120
Tel: 886-7-361-3131; Fax: 886-7-363-2319
- Edward S. Duh, Special Assistant to the President, Board of
J.Y. Horng, Vice President, Semiconductor Group
W.L. Shieh, R&D Department Manager, Semiconductor Group
C.M. Wu, Director of Operations, Semiconductor Group
C.Y. Lin, Assistant Vice President, Finished Products Group
Allen K. Lin, Account Manager, Desktop Computer Group, Finished
N.C. Chiang, Director Customer Service Division, Finished Products
Wayne W.F. Fu, Group Leader, Notebook Computer Group, Finished
Mission and strategy
- OSE produces IC packages and PCB assemblies and finished products
(FP) for OEM customers. The strategy is to become the manufacturing arm
- OSE Semiconductors specializes in plastic and hermetic IC packaging
and testing. OSE designs the printed circuit layout of substrates for
BGA assembly. New products include thin packages, P-BGA, and MCM-L
- OSE finished products are 100% OEM for PCB assemblies and finished
products for desktop computers (40%), notebook computers (5%),
PCMCIA/TCP cards (20%), network cards (15%), and industrial controls
(5%). Motherboards, network cards, and PCMCIA cards account for 80% of
- As desktop motherboards move to China and India, OSE is focusing on
BGA, TCP, and SMT technologies for PCMCIA cards and notebook
Key elements of presentation
- OSE has 25 years of IC and assembly experience. 1995 revenues were
over $230 million.
- OSE employs about 2,332 people, 729 in finished products, 1,528 in
semiconductor group, and 75 in finance, administration, and EDP.
- Of sales, Taiwan represents 40%, Europe represents 15%, and the
- 10 customers account for 85% of IC sales; 3 customers account for
80% of FP sales.
- IC packaging production includes PDIP from 8 pin to 42 pin, PLCC
from 20 to 84 pin count, SOJ-28 pin for SRAM and DRAM, SOP from 150 mil
to 500 mil, and 150 mil (.3mm) SSOP design. TSSOP and TSOP with 1.0 mm
body thickness began mass-production in 1995. They are used for PCMCIA
cards and notebooks. QFP have pin counts from 44 to 256; LQFP have a
1.4 mm body thickness with pin counts from 48-176.
- Leased lines (128K) to the United States allow for rapid
communication and e-mail.
- OSE has had ISO 9002 certification for both semiconductor and
finished product assembly since 1993.
Key elements of tour
- 310 wire bonders get a 99.8 or 99.9% yield, with 70% expansion to
560 wire bonders in a class 10 cleanroom in 1996. One operator handles
12 bonders. A second operator focuses on quality. There is automatic
detection of failures, and a no-rework policy.
- Packaging of BGA with 328 I/O in pilot phase with 1,800,000 per
month capacity in 1996. Prototype MCM-L with four chips and 500 I/O
- 100,000 desktop motherboards are produced per month. Long SMT lines
include two Fuji high-speed chip shooters (CP-6 has 0.09 seconds
placement) of 0603 components. Dual head Fuji machine places two QFPs
at one time, or 320 pin count BGA devices.
- TCP notebook daughter cards with Pentium CPU are produced with
- 35 million completed chips are produced per month with 25% having
high pin counts (over 100 pins) using 145 different types of lead
- OSE develops its own loading and off-loading equipment and related
tools and jigs.
- IC packaging and assembly technologies include BGA, TCP, and MCM
- OSE keeps excess capacity and flexibility to meet customer's
- OSE has semiconductor design capability for new packages, lead
frames, heat dissipation, and BGA/MCM substrates; and tooling and
equipment design capabilities for loading-unloading, mold-dejunk-trim
and form-singulation of die sets, UV and laser marking, and in-line
integration of marker and form-singulation equipment.
- Combined IC packaging and PCB assembly with equipment capability
Published: May 1997; WTEC