Site:
Motorola Microcontroler Technology Group - Kuala Lumpur, Malaysia
#2, Jalan SS 8/2, Sungei Way Free Trade Zone, 47300 Petaling Jaya, Selangor Darul Ehsan
P.O. Box 1001, Jalan Semangat, 46960 Petaling Jaya, Malaysia
Participants:
Roger Bertelson, Vice President, Managing Director, Country Manager
A. Lew, Assistant General Manager
C. Liew, CIM Manager, Factory Automation
H. Yang, Manager, Reliability & Quality Assurance
Latifah M. Daud, Organization Development Manager

Mission and Strategy

The Kuala Lumpur facility is the largest Motorola IC packaging facility in the world and employs 5,000 people. The Motorola R&D model is to co-locate the IC packaging development with the design center, thus Austin develops the microprocessor and DRAM packaging. Kuala Lumpur is responsible for volume production, which includes product engineering responsible for process qualification, yield management, and product qualification. New product prototyping is performed at the U.S. facilities. Kuala Lumpur builds QFP, DIPs, SOJs, TSOPS, and ceramic packages. It is working on implementing BGA but has no plans for flip chip technology in Kuala Lumpur.

Key Elements of Presentation

4 Motorola facilities in Malaysia employ a total of 13,000 employees:

Motorola has had a facility in Kuala Lumpur for 23 years and has manufactured there for the last 22 years.

Key Elements of Tour

Key Results

Kuala Lumpur is the leader within Motorola for reliability and quality while maintaining competitive yields for more complex package types.

Conclusions

The Kuala Lumpur factory shows visible signs of the Motorola 6 sigma and 10X quality activities.


Published: May 1997; WTEC Hyper-Librarian