- Texas Instruments - Singapore
990 Bendemeer Rd., Singapore 1233
- Goh Geok Ling, Managing Director
Goh Jing Sua, Manager, Advanced Package Development
Ignatius Yeo, Manager, Site QRA
Swee Yong Khim, Manager, Failure Analysis & Chemical Lab
Mission and Strategy
- TI has multiple facilities in Singapore, which include TECH
Semiconductor (consortium with TI, EDB, Canon and Hewlett-Packard), TI
distribution center, TI Software, process automation center (design and
manufacturing of IC assembly and test equipment) and the Bendemeer IC
assembly and test facility.
- The TI Singapore mission statement is, "Be the leading
semiconductor company in Singapore and the preferred supplier of those
customers and markets we target."
- TI Singapore has a very obvious customer focus on quality and
delivery. It had a 99.5% on-time delivery record for the first quarter
of 1996. Understanding of the customers' volumetric needs, quality
needs, and reliability needs enables it to develop new IC packaging
technology to support its customer base at a competitive total cost of
Key Elements of Presentation
TI on a global basis has located its facilities near its customers
and has reduced its customer base and product focus. The TI Asian
locations each have been assigned specific IC packaging missions:
Malaysia - Bi-polar logic
Philippines - ASICs
Taiwan - Linear products
Singapore - Memory
Key Elements of Tour
- The TI Singapore IC packaging facility is TI's only large-scale
DRAM packaging facility (it assembles and tests well in excess of 95%
of its worldwide DRAM production, although there is a small facility in
Japan that produces a small amount of specialized DRAMs for the
Japanese market.) The facility was established in 1968 to package
transistors/logic/bipolar products. The plant was in production 50 days
after the signing of the contract with the Singapore government. It
began producing DRAMs in 1974.
- It employs 2,200 people with 58% direct labor, 24% non-exempt, and
18% exempt. The workforce consists of Chinese (67%), Malay (21%), and
others (12%). Their attrition is average for the area, and most of the
employees who leave have been with the company for a short time. This
is manifested by the fact that 41% of their employees have less than 5
years of service.
- Initially the packaging technology was developed in the United
States, then product-specific packaging was done in Singapore. Today
all DRAM packing responsibility for TI resides in Singapore. NSTB gave
a $1.27 million packaging award to TI Singapore.
- TI Singapore leverages three forces in the improvement of IC
packaging technology. These are (1) continuous miniaturization, (2)
density improvement driven by component integration, and (3) the
development of IC packaging at the assembly site. IME failure analysis
facilities are leveraged for quick turnaround on sample production. As
a result of all this leverage, TI has not had a packaging related
qualification failure since 1989.
- The TI Singapore IC packaging facility is very capital-intensive
with $1.1 billion total assets and an annual investment of over $55
million. This facility has achieved a competitive edge in IC packaging
costs, even with more expensive labor, due to its core skills that
facilitate test time reduction, rapid time to yield, high yields, and a
high degree of automation.
- TI Singapore has achieved a competitive edge in IC packaging cost
even with more expensive Singapore labor. This competitive edge is due
to a 1% - 2% yield benefit resulting from the core skill base that
facilitates good yields, quick time to yield, lots of automated
equipment, and reduction in process and test times.
Published: May 1997; WTEC