Site:
ST Assembly Test Services (STATS) - Singapore
Participants:
J. C. Lee, General Manager

Mission and Strategy

Key Elements of Presentation

Key Elements of Tour

Key Results

Conclusions

STATS' current IC packaging menu focuses on higher-value-added, larger-pin-count packages of QFP and PLCC devices. Its planned packages include the addition of BGA, TQFP, and TSOP devices.


Published: May 1997; WTEC Hyper-Librarian