- ST Assembly Test Services (STATS) - Singapore
- J. C. Lee, General Manager
Mission and Strategy
- STATS was incorporated in January of 1995. The shareholders of
STATS include Singapore Technologies, EDB, and Seiko-Epson in Japan.
STATS has an approved capital plan of $317.75 million and it currently
has $76.25 million of installed equipment.
- Other members of the semiconductor group are TriTech
Microelectronics International (IC design), Chartered Semiconductor
Manufacturing (wafer fab), and CiNERGi Technology & Devices
- ST Assembly Test Services provides one-stop service to customers
for assembly and testing of ICs.
- Customers include 20 electronic companies, many of which obtain fab
services from Chartered Semiconductor. Seiko-Epson provides technology
transfer and obtains packaging capacity and preferential pricing.
- STATS offers customers total cost reduction and reduced cycle time.
It provides a 2.5-day turnaround on samples at no extra charge.
Key Elements of Presentation
- First assembly started in August 1995 and the first profitable
month was December 1995
- STATS leased 60,000 square feet from Jurong Town Corporation in
1995. It also utilizes 30,000 square feet at Chartered Semiconductor
for IC test. It will occupy a new 500,000 square foot facility,
currently under construction, within the next year.
- STATS is considering establishing a prototype facility within the
Key Elements of Tour
- The key management team for STATS includes many years of experience
with TI, Fairchild, National, and AMD.
- It currently has 410 employees, growing to 600 by the end of
- STATS' new capital investment provides highly automated and faster
equipment that provides better quality and shorter cycle times than
existing competitors who have a "mixed bag" of equipment.
- The Singapore free port allows faster shipment to customers than
competitors in Taiwan who require customs clearance.
STATS' current IC packaging menu focuses on higher-value-added,
larger-pin-count packages of QFP and PLCC devices. Its planned packages
include the addition of BGA, TQFP, and TSOP devices.
Published: May 1997; WTEC