HP has R&D facilities around the globe. Singapore has R&D for inkjet technology, IC packaging, networking solutions, and PC products; inkjet R&D takes place in San Diego, Vancouver, Barcelona, and Singapore (Deskjet 340).
IC packaging R&D for Hewlett-Packard is split between Palo Alto (DCA and flip chip) and Singapore (enhanced BGA and fine pitch).
The Singapore lab leverages technology from other divisions in Hewlett-Packard and cost-reduces the technology for use in its products.
This organization leverages IME capability, Hewlett-Packard capability, and the capability of the silicon package vendor to produce lower-cost and smaller IC packages.