Michael J. Kelly (Panel Co-Chair)
Mike Kelly occupies the Northrop Grumman Endowed Chair of Manufacturing and Design at California State University, Los Angeles. Before accepting that position in 1996, he was a professor in the Georgia Tech School of Management, Public Policy, and International Affairs. He also held the position of Director of the Georgia Tech Manufacturing Research Center. Prior to accepting that position in October 1991, he was Director of the Defense Manufacturing Office at the Defense Advanced Research Projects Agency (DARPA), during which time he was also the Executive Director of the National Advisory Committee on Semiconductors. He came to DARPA in January 1989 from the New Jersey Institute of Technology, where he was Director of Computer Integrated Manufacturing and Technology Transfer.
Dr. Kelly worked at IBM for 17 years beginning in 1969. Prior to that, he was an associate professor of electrical and mechanical engineering, and Director of the Engineering Case Program at Stanford University. His other academic experiences included three years of teaching at the University of Detroit, where he also served as director of the university's computer center, and four years of teaching and administration at Marist College.
Mike holds a BA degree from Marist college; a BEE and MEE from Catholic University; and a Doctor of Engineering degree from the University of Detroit
William R. Boulton (Panel Co-Chair and Principal Author)
Dr. Boulton is the Olan Mills Professor of Strategic Management in the College of Business at Auburn University. He was the director of Auburn University's Center for International Commerce from 1990-1994. He was a Fulbright Scholar in 1986 and Visiting Professor in 1992 and 1993 at Keio University's Graduate Business School in Japan. He was also a visiting scholar at the Institute for Fiscal and Financial Policy of Japan's Ministry of Finance in 1993.
Dr. Boulton's current research is involved with global technology-based competition. His reports cover numerous companies, institutes, universities, and government organizations in Japan, Taiwan, Hong Kong, China, Singapore, and Malaysia. Current activities extensively cover South Korea and China. Dr. Boulton has focused attention on the speed of technology transfer into Asia and the support programs of Asian governments in support of industrial development and growth. Dr. Boulton is author of numerous articles covering topics of competitive strategy, strategic planning, boards of directors, and technology and innovation management. He has published Business Policy: The Art of Strategic Management (1984), The Resource Guide for the Management of Innovation and Technology (1993), and edited The JTEC Panel Report on Electronic Manufacturing and Packaging in Japan (1995). Dr. Boulton received his doctorate from the Harvard Business School in 1977 in the field of business policy and strategy. He previously worked with GTE International Corporation and Singer Corporation in Asia.
Dieter Bergman began his career in 1956 as a designer for Philco Ford in Philadelphia, PA. He assumed the position of supervisor of the printed circuit design group in 1967, and joined the company's advanced technology group where he specialized in printed circuit computer-aided design. In 1962, while at Philco Ford, he became the company's official representative to the IPC. As a member, he received the IPC "President's Award" in 1968 and in the same year assumed the responsibilities of chairman of the Design Committee. He served as chairman of the committee for seven years and during his tenure was the recipient of the IPC "Outstanding Achievement" award for his work in developing the Design Guide.
Bergman was elected Chairman of the IPC Technical Activities Executive Committee in 1974, and later that year joined the IPC as Technical Director. In 1985, he was named to the IPC Hall of Fame, one of the IPC's highest awards.
As Technical Director, he was responsible for the coordination of standards, specifications, and guidelines development; round robin test programs; establishment of workshops and seminars; government and intersociety liaison; and IPC activities in Europe and Asia. As Director of Technology Transfer, he is responsible for moving the information developed by IPC Technical Committees into the manufacturing infrastructure.
He is Chairman of TC52, Printed Circuits of the International Electrotechnical Commission (IEC) and U.S. Technical Advisor to TC91 on Surface Mount Technology. He attended Temple University.
Dr. Chadha is the Technical Lead for the information and process management strategy on the RASSP program, as well as the principal investigator on multiple enterprise engineering, supply chain integration, and process improvement initiatives within Lockheed Martin. Prior to joining Lockheed Martin, Dr. Chadha was an information technology and process improvement consultant for Intergraph Corporation, and a manufacturing information system developer for AT&T. His key areas of technical expertise include large-scale product data management, workflow and document management, expert systems, and business process reengineering. Dr. Chadha is a member of the ASME Engineering Information Management Committee, the Supply Chain Council, and Lockheed Martin-92s PDM subcouncil. Dr. Chadha has published many technical articles and presented his work at a variety of national and international conferences.
Dr. Chadha received his PhD in Mechanical Engineering from Georgia Institute of Technology, a Master's degree in Mechanical Engineering from Southern Illinois University, and a Bachelor's degree in Mechanical Engineering from the University of Roorkee, India.
Nicholas J. Naclerio
Dr. Naclerio heads a team whose mission is to identify emerging industries and develop market entry strategies for Motorola. Prior to joining Motorola in November 1996, Nick was assistant director of the Electronics Technology Office at DARPA. While at DARPA, he initiated and led major programs in simulation and modeling, electronic packaging, and electronic systems manufacturing. He also served as the government representative on the SEMATECH Board of Directors and Executive Director of the National Advisory Committee on Semiconductors.
In 1994, Dr. Naclerio's contributions to the semiconductor industry were recognized with the Arthur S. Fleming award for exceptional public service. He holds a BS degree in Electrical Engineering and Computer Science from Duke University, a Master's equivalent in Materials Science from Cambridge University, and a PhD in Electrical Engineering from the University of Maryland.
Michael Pecht is the Director of the CALCE Electronic Packaging Research Center at the University of Maryland and a full professor with a three-way joint appointment in Mechanical Engineering, Engineering Research, and Systems Research. Dr. Pecht has a BS in Acoustics, a MS in Electrical Engineering, and a MS and PhD in Engineering Mechanics from the University of Wisconsin. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, and a Westinghouse Fellow. He has written eleven books on electronics products development. He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum. He is currently the chief editor for the IEEE Transactions on Components, Packaging, and Manufacturing Technology; SAE Reliability, Maintainability and Supportability Journal; and the International Microelectronics Journal, and is on the advisory board of the Journal of Electronics Manufacturing. He serves on the board of advisors for various companies and consults for the U.S. government, providing expertise in strategic planning in the area of electronics products development and marketing.
The CALCE EPRC at the University of Maryland is sponsored by the National Science Foundation and over 40 industry and government members. The Center is a leading research facility in the design, manufacture, and test of reliable, cost-effective electronic products. The CALCE EPRC provides a resource base to support the development of competitive electronic products and systems in a timely manner. The resource base includes design methods, simulation techniques, models, guidelines, instructional information, and future engineers and technical leaders.
Dr. Gordon Roberts joined the Lucent Technologies Engineering Research Center in 1977 and participated in the development of low-cost plastic packages for CMOS and bipolar integrated circuits. During the 1980s he led the Lucent Technologies program in surface mount technology. His responsibilities included management of materials and manufacturing process development, equipment design, and technology deployment into Lucent factories both in the United States and overseas. More recently, Dr. Roberts led the Lucent program to develop assembly technologies for application in miniaturized portable products. In his current position he is responsible for the application of breakthrough technologies to electronic switching systems. Dr. Roberts has a BS in Chemistry and a PhD in Physical Chemistry from the University of Aston, Birmingham, England.
Amalendu Sanyal is the principal engineer reporting to Digital Equipment Corporation's module manufacturing technology manager in Littleton, Mass. This is part of the central manufacturing group supporting module (electronic assembly) plants located in Canada, Scotland, Singapore, and Taiwan.
Prior to joining Digital, Sanyal worked as a manufacturing engineer at Bell & Howell's communication division in Burlington, Mass. At Bell & Howell, he was responsible for new product introduction and supported manufacturing processes for the pager and communication products. He joined Digital at its high-volume manufacturing plant and supported the module assembly operation. In 1979 he joined the Complex Module business at Digital in Massachusetts.
Sanyal was part of the team responsible for developing the SMT process for Digital plants. He designed and published the SMT Land Pattern Guide for manufacturing (an internal publication). He managed a group of development engineers and technicians involved in advanced development of future module assembly interconnect technologies, and developed and managed delivery of SMT process to manufacturing plants. In 1992 he provided leadership for the technology forecast project aimed at providing inputs to various technology groups on important technical development and recommended technology investment options.
Currently Sanyal is responsible for benchmarking, comparative analysis, and technology forecasting for the module assembly business. He is a joint owner of a patent on "step-stencil." Sanyal has an MS in mechanical engineering and an MS in engineering management. He is a member of SMTA.
William A. Tucker
Mr. Tucker joined IBM in 1969 at the Boca Raton, Florida, Development Laboratory, where he held several technical and managerial positions in both engineering and programming development of the IBM System/7. In 1977, he transferred to the Austin, Texas, Development Laboratory, where he was responsible for design of the document distribution hardware and microcode for the IBM 5520 Administrative System. He subsequently was named senior programming manager responsible for all software support of the IBM 5520 administrative system. In 1983, he was named assistant to the vice president, Office Systems and Programmable Workstations, for the Communications Products Division in White Plains, New York. Later that year he was promoted to manager of quality assurance for Entry Systems Division in Austin, Texas, responsible for logic board assemblies and box manufacturing for the Austin site, which included qualification of surface mount technology (SMT) within IBM.
From 1986 until 1991 Mr. Tucker held several management positions responsible for worldwide new product introduction and manufacturability of electronic card assemblies. In 1992, he established the Austin OEM electronic card manufacturing business. Mr. Tucker served as Global Procurement Program manager responsible for ensuring worldwide competitive sourcing of electronic card assemblies from 1993 through 1995. He was appointed to his current position in September 1995.
Mr. Tucker has made many contributions to IBM in the areas of hardware design and development, software design and development, and manufacturing of electronic card assemblies. He has authored several technical reports and outside papers. He is one of the pioneers in implementing surface mount technology within IBM Corporation and is a leader in the corporation on competitive manufacturing costs of electronic assemblies.
Mr. Tucker received a Bachelor of Science degree in Industrial Engineering from Auburn University in 1969 and a Masters of Business Administration degree from the University of Texas in 1991.
E. Jan Vardaman
E. Jan Vardaman received her Bachelor of Arts in Economics and Business in 1979 from Mercer University and her Master's degree in Economics in 1981 from the University of Texas. After working as a government computer industry analyst, she joined the corporate staff of Microelectronics and Computer Technology Corporation (MCC) in 1984, where she analyzed developments in semiconductor packaging and assembly.
In 1987, she founded TechSearch International, providing services in licensing electronics technology and reporting technical information on international developments in the electronics industry. She is the editor of Surface Mount Technology: Recent Japanese Developments, is a columnist for Circuits Assembly magazine, is on the editorial board of Advanced Packaging Magazine, and is author of numerous publications on emerging trends in semiconductor packaging and assembly. She has made presentations on developments in TAB, flip chip, ball grid array packages, chip size packaging, and multichip modules in Asia, the United States, and Europe. She is a member of IEEE's CPMT society and ISHM/IEPS. She was the 1996 General Chair of IEEE's International Electronics Manufacturing Technology Symposium held at Semicon Southwest.
Samuel Robert Wennberg
Mr. Wennberg has worked 17 years for Delco Electronics, a subsidiary of General Motors. In the 17 years he has worked in product design, finance, quality, production readiness, manufacturing engineering, and research and development. Mr. Wennberg is the founder and leader of the Delco Electronics' Advanced Manufacturing Engineering team, which led the effort to develop the next generation of electronic manufacturing technology being deployed within Delco Electronics and throughout the electronics industry. The Advanced Manufacturing Engineering team was formed to develop this new technology and consisted of 50 engineers and scientists located in Singapore and the United States.
Based on his industry reputation Mr. Wennberg was asked in 1995 to launch the National Electronics Manufacturing Initiative (NEMI), as the first director of operations. NEMI is an organization that works with U.S. electronics industry manufacturers, associations, and the U.S. government to improve the electronics manufacturing infrastructure in the United States. NEMI was successfully launched and is in the process of publishing its manufacturing technology roadmap for the electronics industry. Since his return to Delco Electronics, Mr. Wennberg has assumed the position of manager for technology assessment and acquisition. Current technical areas of interest and study include multimedia, communications, system and software processes, manufacturing and packaging, and vehicle system integration.