PPT Slide

Wafer fabrication


Chip
singulation


Chip
packaging


200 mm


2 -10 mm


10 - 30 mm


PWB fabrication


PWB (board-level) assembly


100 - 300 mm


100 - 300 mm


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Published July 13, 2000; WTEC Workshop on Environmentally Benign Manufacturing (EBM) Technologies